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2012年1期
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Bonding interface between TiAl intermetallic compound and Ti under the electric field
Bonding interface between TiAl intermetallic compound and Ti under the electric field
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摘要
未填写
DOI
kd217l8kj6/1151662
作者
王福明;陈少平;胡利方;梁连杰;孟庆森
机构地区
不详
出处
《中国焊接:英文版》
2012年1期
关键词
TIAL金属间化合物
电场作用
扫描电子显微镜
界面
键合
辅助合成
分类
[金属学及工艺][焊接]
出版日期
2012年01月11日(中国期刊网平台首次上网日期,不代表论文的发表时间)
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来源期刊
中国焊接:英文版
2012年1期
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相关关键词
TIAL金属间化合物
电场作用
扫描电子显微镜
界面
键合
辅助合成
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