Electrochemical behavior of Cu-Zn-Al shape memory alloy after surface modification by electroless plated Ni-P

TheelectrochemicalbehaviorofCu-Zn-Alshapememoryalloy(SMA)withandwithoutelectrolessplatedNi-PwasinvestigatedbyelectrochemicalmethodsinartificialTyrode'ssolution.TheresultsshowedthatCu-Zn-AlSMAengendereddezincificationcorrosioninTyrode'ssolution.TheanodicactivecurrentdensitiesaswellaselectrochemicaldissolutionsensitivityoftheelectrolessplatedNi-PCu-Zn-AlSMAincreasedwithNaClconcentrationrising,pHofsolutiondecreasingandenvironmentaltemperatureuprising.X-raydiffractionanalysisindicatedthataftersurfacemodificationbyelectrolessplatedNi-P,anamorphousplatedfilmformedonthesurfaceofCu-Zn-AlSMA.ThisfilmcaneffectivelyisolatematrixmetalfromcorrosionmediaandsignificantlyimprovetheelectrochemicalpropertyofCu-Zn-AlSMAinartificialTyrode'ssolution.