简介:ThemicrostructureandtensilepropertiesofSn-9Znsolderunderdifferentcoolingandagingconditionwerestudied.Duringsolidification,thedistributionofZn-richphasesandgrainsizeinthemicrostructureofSn-9Znsolderweredecidedbythecoolingrate.TheZn-richphaseinSn-9Znsolderunderfurnacecooling,aircoolingandwatercoolingmediawasseparatelyexistedascoarsendendriticandneedlelikeshape,fineneedlelikeshapeandveryfinerod-likeshape,respectively.Afteraging,thecoarsendendriticwasbrokenandthecoarsenneedlelikeZn-richphasewaspartlychangedintofinedistributionofZn-richphaseforSn-9Znsolderwithfurnacecooling,andtherod-likeZnphaseintheSn-9ZnsolderunderwatercoolingwaschangedtoconglomeratedZnwithneedleshape.DuringtensiletestingonSn-9Znsolder,tensilestrengthandductilityreachedthebestwithwatercooling,butdecreasedwithagingeffect.Meanwhile,theductilityofsolderwithaircoolingandthestrengthofsolderwithfurnacecoolingincreasedwithaging.Thefracturemodewasductileandwasindependentofcoolingmediaandagingeffect.Thesizeanddepthofdimplesdecreasedfromwater,furnacetoaircooling.Afteraging,numberandsizeofdimplesincreasedonthesolderwithfurnacecoolingandaircooling.ThechangeonthesizeofdimplesfortheSn-9Znsolderunderdifferentcoolingconditionandwithagingeffectwasaccordancetothetensileproperties.